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Realizing correct fusion welding and stripping
Applicable for lead-free and minute material.

Realizing the most suitable minute stripping and connection depending on material.
As this is a core technology which NITTOKU has cultivated for many years, optimal bonding and stripping methods will vary based on the product.
In recent years NITTOKU has also successfully developed micro dispensing equipment.

Optimal bonding/stripping methods
Process Example Method Examples
Solder Dip/Iron/Sleeve/Wave/Laser
Welding Fusing/Micro-arc/TIG/Thermo-compression/Laser/USW
Stripping Diamond Chip/Laser/Polishing (grindstone)/Heat
Stripping cases
Stripping cases
Micro Dispensing

NITTOKU’s minute dispense unit (microdispensing) has the following Characteristics.

●Highly accurate minute dispensing
●Synchronized operation and dispensing control

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